RK3399 64-Bit Processor Cortex-A72 Android developement Board
The core board uses RK3399 quad-core Cortex-A72 ×2+ Cortex-A53×4) processor with a main frequency of up to 2.0 GHz. The core board adopts a 6-layer process board design with a size of only 82mm×60mm. It has excellent characteristics such as high performance, low cost, rich expansion interfaces, and small size. It can be embedded in any system as an independent module. It is suitable for enterprise-embedded product development, saving development time, reducing product development risks, and accelerating the product launch cycle.
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Core- 3399J (Commercial Grade) |
Core- 3 3 9 9 KJ(Industrial wide temperature) |
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Basic parameters |
CPU |
RK3399 Six-core 64-bit (Cortex-A72×2 + Cortex-A53×4) processor, up to 1.8GHz |
RK3399K Six-core 64-bit (Cortex-A72×2 + Cortex-A53×4) processor, up to 2.0GHz |
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GPU |
Mali-T860 MP4 quad-core GPU, supports OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11, supports AFBC (frame buffer compression) |
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ISP |
Built-in dual hardware ISP, supports up to single 13M pixel or dual 8M pixel |
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VPU/Codec |
Hard decoding: 4K@60fps H265/H264/VP9 video decoding, 1080P multi-format video decoding (VC-1, MPEG-1/2/4, VP8) Hard encoding: 1080P H.264/AVC/VP8 video encoding Video post-processor: de-interlacing, denoising, edge/detail/color optimization |
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Memory |
LPDDR4 (2GB/4GB optional) |
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Storage |
eMMC (16GB/32GB/64GB/128GB optional) |
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Power |
5V (voltage error ± 5%) |
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System |
Android, Linux OS, domestic operating systems |
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Interface |
Gold finger (314 Pin, MXM3.0, 0.5mm pitch) |
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Dimensions |
82mm * 63mm |
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Power Consumption |
Sleep power consumption: ≈0.125W (5.0V/25mA) Typical power consumption: ≈2.0W (5.0V/400mA) Maximum power consumption: ≈10.0W (5.0V/2.0A) |
Sleep power consumption: ≈0.125W (5.0V/25mA) Typical power consumption: ≈2.0W (5.0V/400mA) Maximum power consumption: ≈10.0W (5.0V/2.0A) |
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Environment |
Working temperature: -20℃ ~ 60℃ Working humidity: 10%～90%RH (no condensation) |
Working temperature: -20℃ ~ 70℃ Working humidity: 10%～90%RH (no condensation) |
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Interface parameters |
Network |
Integrated GMAC/SDIO3.0/USB3.0 interface, expandable Gigabit Ethernet, 2.4G Hz/5G Hz dual-band WiFi/Bluetooth, 3G/4G LTE |
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Video input |
2 * MIPI-CSI (4Lane), 1 * DVP interface (supports up to 5M pixel) |
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Video output |
1 * HDMI 2.0, supports 4K@60fps output and HDCP 1.4/2.2 1 * MIPI-DSI, supports single-channel 2560 * 1600@60fps output 1 * eDP 1.3 (4 lanes with 10.8Gbps) 1 * DP 1.2 (DisplayPort), supports up to 4K*2K@60Hz resolution output (can be output from Type-C interface) * Supports dual-screen same display and dual-screen different display |
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Audio output |
1 * SPDIF, 3 * I2S (I2S0/I2S2 supports 8-channel input/output, I2S2 internally provides HDMI/DP audio output) |
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USB |
2 * USB2.0 、2 * USB3.0 |
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PCIe |
1 * PCIe2.1 |
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Other interfaces |
8*I2C 、8*SPI 、5*UART 、5*ADC 、5*PWM 、1 * SDMMC 、GPIOs |
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It can be applied to products in various industries by simply expanding the functional baseboard: amusement/game equipment, commercial display integrated equipment, medical and health equipment, vending machines, smart POS machines, interactive printers, smart robots, industrial computers.
